
This is information on a product in full production. April 2015 DocID026906 Rev 3 1/27SP1MLSPIRIT1 868 and 915 MHz low power RF modules with integrate
Hardware design SP1ML10/27 DocID026906 Rev 32 Hardware design2.1 Pin usageIf used with the default firmware and interfaced to a host MCU, at a minimum
DocID026906 Rev 3 11/27SP1ML Hardware design272.2 Typical application circuitIn a typical application the SP1ML module is connected to a host MCU usi
Hardware design SP1ML12/27 DocID026906 Rev 3of minimal width traces from pins 1, 2, 3, 4, 13 and 14 of the module if these are used. It is appropriate
DocID026906 Rev 3 13/27SP1ML Hardware design272.4 Recommended footprintFigure 5. Recommended footprint2.5 Module reflow installationThe SP1ML is a su
Hardware design SP1ML14/27 DocID026906 Rev 3Figure 6. Soldering profileTime maintained above:– Temperature TL– Temperature TL217 °C60-70 secPeak tempe
DocID026906 Rev 3 15/27SP1ML Module operation273 Module operationThe SP1ML module is provided with firmware that supports wireless serial cable replac
Module operation SP1ML16/27 DocID026906 Rev 3Table 9. Command referenceCommand DescriptionATOEnter operating modeThis command is issued to exit comman
DocID026906 Rev 3 17/27SP1ML Module operation273.4 Configuration registersThe configuration registers contain the radio, packet and general configurat
Module operation SP1ML18/27 DocID026906 Rev 3Table 10. Configuration registers# Name DescriptionS00 BAUD_RATEGeneral: Baud rate of the UART interface
DocID026906 Rev 3 19/27SP1ML Module operation27S08 RSSI_THRESHOLDRadio: Carrier sense RSSI threshold in dBm.Values: -130 to -3Default: -130S09 PREAMBL
Contents SP1ML2/27 DocID026906 Rev 3Contents1 Hardware specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61.
Module operation SP1ML20/27 DocID026906 Rev 3S18 BROADCAST_ADDRAddress: The 8-bit broadcast address, used for broadcast filtering on received packets.
DocID026906 Rev 3 21/27SP1ML Module operation273.5 Information registers3.6 Example command sequenceTable 12 shows a typical command sequence to ente
ECOPACK®SP1ML22/27 DocID026906 Rev 34 ECOPACK®In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® pac
DocID026906 Rev 3 23/27SP1ML Regulatory compliance276 Regulatory compliance6.1 CE certificationThe module has been certified in accordance with the fo
Regulatory compliance SP1ML24/27 DocID026906 Rev 3The OEM must include the following statements on the exterior of the final product unless the produc
DocID026906 Rev 3 25/27SP1ML Ordering Information277 Ordering InformationTable 13. Ordering informationOrder code DescriptionSP1ML-868 868 MHz SPIRIT1
Revision history SP1ML26/27 DocID026906 Rev 38 Revision history Table 14. Document revision historyDate Revision Changes24-Oct-2014 1 Initial
DocID026906 Rev 3 27/27SP1ML27 IMPORTANT NOTICE – PLEASE READ CAREFULLYSTMicroelectronics NV and its subsidiaries (“ST”) reserve the right to
DocID026906 Rev 3 3/27SP1ML Contents276.2 FCC certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
List of tables SP1ML4/27 DocID026906 Rev 3List of tablesTable 1. Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . .
DocID026906 Rev 3 5/27SP1ML List of figures27List of figuresFigure 1. Pin placement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Hardware specification SP1ML6/27 DocID026906 Rev 31 Hardware specificationGeneral conditions (VIN = 3 V and TA = 25 °C).1.1 Recommended operating cond
DocID026906 Rev 3 7/27SP1ML Hardware specification271.4 Current consumption1.5 RF compliance limitsThe RF compliance limits are those tested for FCC
Hardware specification SP1ML8/27 DocID026906 Rev 31.6 Pin assignmentTable 6. Pin assignmentPin Name Type Description STM32L pin(1)1 TXRXLED O Active l
DocID026906 Rev 3 9/27SP1ML Hardware specification271.7 Pin placementFigure 1. Pin placement1.8 Hardware block diagramFigure 2. Hardware block diagra
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